Display apparatus having reduced defects

ABSTRACT

Provided is a display apparatus capable of reducing generation of defects during manufacturing of the display apparatus or while in use after being manufactured. The display apparatus includes a substrate including a bending area between a first area and a second area, the substrate being bent in the bending area about a bending axis; an inorganic insulating layer over the substrate and including a first feature that is either a first opening or a first groove, the first feature positioned to correspond to the bending area; and an organic material layer at least partially filling the first feature, and including a second feature that is a second opening or a second groove, the second feature extending along an edge of the substrate.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of U.S. patentapplication Ser. No. 16/505,638 filed on Jul. 8, 2019, which is acontinuation application of U.S. patent application Ser. No. 16/167,211filed on Oct. 22, 2018 (Now U.S. Pat. No. 10,388,715), which is acontinuation application of U.S. patent application Ser. No. 15/617,895filed on Jun. 8, 2017 (Now U.S. Pat. No. 10,134,827), which claimspriority to and the benefit of Korean Patent Application No.10-2016-0104990 filed on Aug. 18, 2016 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND 1. Field

One or more embodiments relate to a display apparatus, and moreparticularly, to a display apparatus capable of reducing occurrence ofdefects during manufacture or in subsequent use.

2. Description of the Related Art

In general, a display apparatus includes a display unit above asubstrate. When such a display apparatus is at least partially bent,visibility at various angles may be improved or the size of anon-display area may be reduced.

However, in a display apparatus according to the prior art, defects mayoccur at a bending portion or nearby, during manufacture or later use.

SUMMARY

One or more embodiments include a display apparatus capable of reducingoccurrence of defects during manufacturing of the display apparatus orwhile in use after being manufactured.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented or other embodiments.

According to one or more embodiments, a display apparatus includes: asubstrate including a bending area between a first area and a secondarea, the substrate being bent in the bending area about a bending axis;an inorganic insulating layer over the substrate and including a firstfeature that is a first opening or a first groove, the first featurepositioned to correspond to the bending area; and an organic materiallayer at least partially filling the first feature, and including asecond feature that is a second opening or a second groove, the secondfeature extending along an edge of the substrate.

At least one of the first opening and the second groove may overlap thebending area. An area of the first opening or the first groove may begreater than an area of the bending area. A length of the second openingor the second groove may be greater than a width of the bending area ina direction from the first area to the second area.

The display apparatus may further include a first conductive layer overthe organic material layer, the first conductive layer extending fromthe first area to the second area across the bending area.

A width of one of the first opening and the first groove may be greaterthan a length of one of the second opening and the second groove. Thedisplay apparatus may further include an additional organic materiallayer covering the first conductive layer and the organic materiallayer, wherein the additional organic material layer may include a thirdfeature that is a third opening or a third groove, the third featureextending along the edge of the substrate so as to correspond to thesecond opening or the second groove.

A length of one of the second opening and the second groove may begreater than a length of one of the third opening and the third groove.

The additional organic material layer may cover a side of the secondopening or the second groove. The display apparatus may further includea conductive remaining layer over at least a part of a side of thesecond opening or the second groove, wherein the additional organicmaterial layer may cover the conductive remaining layer. The conductiveremaining layer may include a same material as the first conductivelayer.

The display apparatus may further include a second conductive layer inthe first area or the second area so as to be located on a layerdifferent from a layer on which the first conductive layer is located,the second conductive layer being electrically connected to the firstconductive layer. An elongation rate of the first conductive layer maybe greater than an elongation rate of the second conductive layer.

The organic material layer may include an additional opening or anadditional groove extending along an edge of the substrate to beadjacent to the second opening or the second groove. A length of theadditional opening or the additional groove may be less than a length ofthe second opening or the second groove, and the additional opening orthe additional groove may cross a virtual line extending parallel withthe bending axis and crossing a center of the bending area.

The second opening or the second groove may have a first width at afirst portion proximate to a center of the bending area and a secondwidth remote from the first portion, the first width being greater thanthe second width.

The organic material layer may further include an auxiliary opening oran auxiliary groove connected to the second opening or the second grooveand extending in a direction crossing a direction in which the secondopening or the second groove extends.

The display apparatus may further include a bending protection layerfilling the second opening or the second groove. The bending protectionlayer may cover the bending area.

According to one or more embodiments, a display apparatus includes: asubstrate including a bending area between a first area and a secondarea, the substrate being bent in the bending area about a bending axis;a first conductive layer extending from the first area to the secondarea across the bending area; and an insulating layer between thesubstrate and the first conductive layer and including an opening or agroove, the opening or groove extending in a direction crossing thebending axis so as to correspond to a portion between an edge of thesubstrate and the first conductive layer in the bending area.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1 is a schematic perspective view of a part of a display apparatusaccording to an embodiment;

FIG. 2 is a schematic cross-sectional view of a part of the displayapparatus of FIG. 1;

FIG. 3 is a schematic plan view of a part of the display apparatus ofFIG. 1;

FIG. 4 is a schematic cross-sectional view taken along a line IV-IV ofFIG. 3;

FIG. 5 is a schematic cross-sectional view of a part of a displayapparatus according to an embodiment;

FIG. 6 is a schematic cross-sectional view of a part of a displayapparatus according to an embodiment;

FIG. 7 is an enlarged cross-sectional view of a part A of FIG. 6;

FIG. 8 is a schematic cross-sectional view taken along a line VIII-VIIIof FIG. 3;

FIG. 9 is a schematic plan view of a part of a display apparatusaccording to an embodiment;

FIG. 10 is a schematic plan view of a part of a display apparatusaccording to an embodiment;

FIG. 11 is a schematic plan view of a part of a display apparatusaccording to an embodiment;

FIG. 12 is a schematic plan view of a part of a display apparatusaccording to an embodiment;

FIG. 13 is a schematic plan view of a part of a display apparatusaccording to an embodiment;

FIG. 14 is a schematic plan view of a part of a display apparatusaccording to an embodiment;

FIG. 15 is a schematic cross-sectional view taken along a line XV-XV ofFIG. 14;

FIG. 16 is a schematic cross-sectional view of a part of a displayapparatus according to an embodiment; and

FIG. 17 is a schematic cross-sectional view of a part of a displayapparatus according to an embodiment.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals refer to like elements throughout. In this regard, the presentembodiments may have different forms and should not be construed asbeing limited to the descriptions set forth herein. Accordingly, theembodiments are merely described below, by referring to the figures, toexplain aspects of the present description. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items. Expressions such as “at least one of,” whenpreceding a list of elements, modify the entire list of elements and donot modify the individual elements of the list. All numerical values areapproximate, and may vary. All examples of specific materials andcompositions are to be taken as nonlimiting and exemplary only. Othersuitable materials and compositions may be used instead.

Hereinafter, the present disclosure will be described in detail byexplaining preferred embodiments of the inventive concept with referenceto the attached drawings. Like reference numerals in the drawings denotelike elements.

Sizes of components in the drawings may be exaggerated for convenienceof explanation. In other words, since sizes and thicknesses ofcomponents in the drawings are arbitrarily illustrated for convenienceof explanation, the following embodiments are not limited thereto, andthe drawings are not necessarily to scale.

In the following examples, an x-axis, a y-axis and a z-axis are notlimited to three axes of the rectangular coordinate system, and may beinterpreted in a broader sense. For example, the x-axis, the y-axis, andthe z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another.

FIG. 1 is a schematic perspective view of a display apparatus accordingto an embodiment, FIG. 2 is a schematic cross-sectional view of a partof the display apparatus of FIG. 1, and FIG. 3 is a schematic plan viewof a part of the display apparatus of FIG. 1.

As shown in FIGS. 1 to 3, a substrate 100 in the display apparatusaccording to the embodiment includes a bending area BA extending in afirst direction (+y direction). The bending area BA is between a firstarea 1A and a second area 2A in a second direction (+x direction)crossing the first direction. In addition, the substrate 100 is bentabout a bending axis BAX extending in the first direction (+y direction)as shown in FIG. 1. The substrate 100 may include various materialshaving flexible or bendable characteristics, e.g., polymer resins suchas polyethersulphone (PES), polyacrylate, polyetherimide (PEI),polyethylene naphthalate (PEN), polyethylene terephthalate (PET),polyphenylene sulfide (PPS), polyarylate (PAR), polyimide (PI),polycarbonate (PC), and cellulose acetate propionate (CAP). Thesubstrate 100 may have a multi-layered structure including two layershaving one or more of the above polymer resins, as well as a barrierlayer including an inorganic material such as silicon oxide, siliconnitride, and silicon oxynitride between the two layers.

In FIG. 1, the substrate 100 has a constant width in a y-axis directionthroughout the first area 1A, the bending area BA, and the second area2A, but is not limited thereto. For example, as shown in FIG. 3, thesubstrate 100 may have a width varying in the y-axis direction withinthe first area 1A. In this case, a narrower width of the substrate 100within the first area 1A may be equal to the width of the substratewithin the bending area BA or in the second area 2A, as shown in FIG. 3.

The first area 1A includes a display area DA. The first area 1A mayfurther include a part of a non-display area outside the display areaDA, in addition to the display area DA, as shown in FIG. 2. The secondarea 2A may also include the non-display area.

In the display area DA of the substrate 100, a thin film transistor(TFT) 210 electrically connected to a display device 300 may be locatedin addition to the display device 300, as shown in FIG. 2. In FIG. 2, anorganic light-emitting device is located in the display area DA as thedisplay device 300. Electric connection of the organic light-emittingdevice to the TFT 210 may be understood as a pixel electrode 310 beingelectrically connected to the TFT 210.

The TFT 210 may include a semiconductor layer 211 including amorphoussilicon, polycrystalline silicon, or an organic semiconductor material.The TFT 210 may also include a gate electrode 213, a source electrode215 a, and a drain electrode 215 b. In order to ensure insulationbetween the semiconductor layer 211 and the gate electrode 213, a gateinsulating layer 120 may be formed between the semiconductor layer 211and the gate electrode 213, wherein the gate insulating layer 120includes an inorganic material such as silicon oxide, silicon nitride,and/or silicon oxynitride. In addition, an interlayer insulating layer130 may be on the gate electrode 213, and the source electrode 215 a andthe drain electrode 215 b may be on the interlayer insulating layer 130,wherein the interlayer insulating layer 130 includes an inorganicmaterial such as silicon oxide, silicon nitride, and/or siliconoxynitride. The insulating layers including the inorganic material maybe formed by chemical vapor deposition (CVD) or atomic layer deposition(ALD). This will be applied to other embodiments and modificationsthereof that will be described later.

A buffer layer 110 may be between the TFT 210 having the above structureand the substrate 100. The buffer layer 110 may include an inorganicmaterial such as silicon oxide, silicon nitride, and/or siliconoxynitride. The buffer layer 110 may improve smoothness of the uppersurface of the substrate 100, or prevent or reduce infiltration ofimpurities from the substrate 100 into the semiconductor layer 211 ofthe TFT 210.

A planarization layer 140 may be arranged on the TFT 210. For example,as shown in FIG. 2, when the organic light-emitting device is on the TFT210, the planarization layer 140 may planarize an upper portion of theTFT 210. The planarization layer 140 may include, for example, anorganic material such as acryl, benzocyclobutene (BCB), andhexamethyldisiloxane (HMDSO). In FIG. 2, although the planarizationlayer 140 has a single-layered structure, the planarization layer 140may be variously modified. For example, the planarization layer 140 mayhave a multi-layered structure. In addition, as shown in FIG. 2, theplanarization layer 140 may have an opening outside the display area DA,so that a part of the planarization layer 140 in the display area DA anda part of the planarization layer 140 in the second area 2A may bephysically separate from each other. Thus, impurities from outside maynot reach the display area DA via the planarization layer 140.

In the display area DA of the substrate 100, the display device 300 maybe on the planarization layer 140. The display device 300 may be anorganic light-emitting device including the pixel electrode 310, anopposite electrode 330, and an intermediate layer 320 between the pixelelectrode 310 and the opposite electrode 330 and including an emissionlayer. The pixel electrode 310 may contact one of the source electrode215 a and the drain electrode 215 b via an opening formed in theplanarization layer 140 and may be electrically connected to the TFT210, as shown in FIG. 2.

A pixel defining layer 150 may be on the planarization layer 140. Thepixel defining layer 150 includes openings corresponding respectively tosub-pixels, that is, at least an opening exposing a center portion ofthe pixel electrode 310, to define pixels. Also, in the example shown inFIG. 2, the pixel defining layer 150 increases a distance between anedge of the pixel electrode 310 and the opposite electrode 330 above thepixel electrode 310 so as to prevent an arc from being generated at theedge of the pixel electrode 310. The pixel defining layer 150 mayinclude an organic material, for example, PI or HMDSO.

The intermediate layer 320 of the organic light-emitting device mayinclude low-molecular weight organic materials or polymer materials.When the intermediate layer 320 includes a low-molecular weight organicmaterial, the emission layer may include a hole injection layer (HIL), ahole transport layer (HTL), an emission layer (EML), an electrontransport layer (ETL), and an electron injection layer (EIL) in a singleor multiple-layered structure, and examples of organic materials mayinclude copper phthalocyanine (CuPc),N,N′-Di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB), andtris-8-hydroxyquinoline aluminum (Alq₃). The low-molecular weightorganic materials may be deposited by a vacuum deposition method.

When the intermediate layer 320 includes a polymer material, theintermediate layer 320 may include an HTL and an EML. Here, the HTL mayinclude poly(3,4-ethylenedioxythiophene (PEDOT), and the EML may includea poly-phenylenevinylene (PPV)-based or polyfluorene-based polymermaterial. The intermediate layer 320 above may be formed by a screenprinting method, an inkjet printing method, or a laser induced thermalimaging (LITI) method.

However, the intermediate layer 320 is not limited to the above example,and may have various structures. In addition, the intermediate layer 320may include a layer that is integrally formed across a plurality ofpixel electrodes 310, or a layer that is patterned to correspond to eachof the plurality of pixel electrodes 310.

The opposite electrode 330 is arranged above the display area DA, and asshown in FIG. 2, may cover the display area DA. That is, the oppositeelectrode 330 may be integrally formed with respect to a plurality oforganic light-emitting devices, so as to correspond to a plurality ofpixel electrodes 310.

Since the organic light-emitting device may be easily damaged byexternal moisture or oxygen, an encapsulation layer 400 may cover theorganic light-emitting device to protect the organic light-emittingdevice. The encapsulation layer 400 covers the display area DA, and mayalso extend outside the display area DA. The encapsulation layer 400 mayinclude a first inorganic encapsulation layer 410, an organicencapsulation layer 420, and a second inorganic encapsulation layer 430,as shown in FIG. 2.

The first inorganic encapsulation layer 410 covers the oppositeelectrode 330, and may include silicon oxide, silicon nitride, and/orsilicon oxynitride. If desired, other layers such as a capping layer maybe arranged between the first inorganic encapsulation layer 410 and theopposite electrode 330. Since the first inorganic encapsulation layer410 is shaped according to its underlying structures, the firstinorganic encapsulation layer 410 may have an uneven upper surface. Theorganic encapsulation layer 420 covers the first inorganic encapsulationlayer 410, and unlike the first inorganic encapsulation layer 410, theorganic encapsulation layer 420 may have an even or substantially flatupper surface. In more detail, the organic encapsulation layer 420 maysubstantially have an even upper surface at a portion corresponding tothe display area DA. The organic encapsulation layer 420 may include atleast one material selected from PET, PEN, PC, PI, polyethylenesulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. Thesecond inorganic encapsulation layer 430 covers the organicencapsulation layer 420, and may include silicon oxide, silicon nitride,and/or silicon oxynitride. The second inorganic encapsulation layer 430may contact the first inorganic encapsulation layer 410 at an edgethereof outside the display area DA, in order not to expose the organicencapsulation layer 420 to the outside.

As described above, since the encapsulation layer 400 includes the firstinorganic encapsulation layer 410, the organic encapsulation layer 420,and the second inorganic encapsulation layer 430, even if there is acrack in the encapsulation layer 400 in the above multi-layeredstructure, the crack may be disconnected between the first inorganicencapsulation layer 410 and the organic encapsulation layer 420 orbetween the organic encapsulation layer 420 and the second inorganicencapsulation layer 430. As such, the likelihood of forming a paththrough which external moisture or oxygen may infiltrate into thedisplay area DA may be reduced.

A polarization plate 520 may be attached on the encapsulation layer 400via an optically clear adhesive (OCA) 510. The polarization layer 520may reduce reflection of external light. For example, when externallight that passes through the polarization plate 520 is reflected by anupper surface of the opposite electrode 330 and then passes through thepolarization plate 520 again, the external light passes through thepolarization plate 520 twice and a phase of the external light may bechanged. Therefore, a phase of reflected light is different from thephase of the external light entering the polarization plate 520 and thusdestructive interference occurs. Accordingly, reflection of externallight may be reduced and visibility may be improved. The OCA 510 and thepolarization plate 520 may cover an opening in the planarization layer140, as shown in FIG. 2. The display apparatus according to one or moreembodiments may not necessarily include the polarization plate 520, andif desired, the polarization plate 520 may be omitted or replaced byother elements. For example, the polarization plate 520 may be omitted,and a black matrix and a color filter may be used to reduce reflectionof external light.

In addition, the buffer layer 110, the gate insulating layer 120, andthe interlayer insulating layer 130 including the inorganic material maybe collectively referred to as an inorganic insulating layer. Theinorganic insulating layer may include a first feature that is a firstopening corresponding to the bending area BA, as shown in FIG. 2. Thatis, the buffer layer 110, the gate insulating layer 120, and theinterlayer insulating layer 130 may respectively include openings 110 a,120 a, and 130 a corresponding to the bending area BA. That the firstopening corresponds to the bending area BA may denote that the openingoverlaps the bending area BA. Here, an area of the first opening may begreater than that of the bending area BA. To do this, in FIG. 2, a widthOW of the first opening is greater than a width BAw of the bending areaBA. Here, the area of the first opening may be defined as the smallestarea among areas of the openings 110 a, 120 a, and 130 a, of the bufferlayer 11, the gate insulating layer 120, and the interlayer insulatinglayer 130. In FIG. 2, the area of the first opening is defined by anarea of the opening 110 a in the buffer layer 110.

After forming the opening 130 a in the buffer layer 130, the opening 120a of the gate insulating layer 120 and the opening 130 a of theinterlayer insulating layer 130 may be simultaneously formed. When theTFT 210 is formed, in order for the source electrode 215 a and the drainelectrode 215 b to contact the semiconductor layer 211, contact holespenetrating through the gate insulating layer 120 and the interlayerinsulating layer 130 have to be formed. Thus, the opening 120 a of thegate insulating layer 120 and the opening 130 a of the interlayerinsulating layer 130 may be simultaneously formed when forming thecontact holes. Accordingly, an internal surface of the opening 120 a ofthe gate insulating layer 120 and an internal surface of the opening 130a of the interlayer insulating layer 130 may form a single continuoussurface as shown in FIG. 2.

The display apparatus according to the embodiment includes an organicmaterial layer 160 at least partially filling the first opening of theinorganic insulating layer. In FIG. 2, the organic material layer 160completely fills the first opening. In addition, the display apparatusaccording to the embodiment includes a first conductive layer 215 c, andthe first conductive layer 215 c extends from the first area 1A to thesecond area 2A across the bending area BA and above the organic materiallayer 160. The first conductive layer 215 c may also extend over aninorganic insulating layer such as the interlayer insulating layer 130,where the organic material layer 160 is not provided. The firstconductive layer 215 c may be formed simultaneously with the sourceelectrode 215 a or the drain electrode 215 b by using the same materialas that of the source electrode 215 a or the drain electrode 215 b.

As described above, although FIG. 2 shows a state in which the displayapparatus is not bent for convenience of description, the displayapparatus according to the embodiment is actually in a state in whichthe substrate 100 is bent at the bending area BA, as shown in FIG. 1. Todo this, the display apparatus is manufactured so that the substrate 100is flat, as shown in FIG. 2, and after that, the substrate 100 is bentat the bending area BA so that the display apparatus may have the shapeas shown in FIG. 1. Here, when the substrate 100 is bent at the bendingarea BA, tensile stress may be induced in the first conductive layer 215c. However, in the display apparatus according to the embodiment, theoccurrence of defects in the first conductive layer 215 c during thebending process may be prevented or reduced.

If the inorganic insulating layers such as the buffer layer 110, thegate insulating layer 120, and/or the interlayer insulating layer 130 donot include openings corresponding to the bending area BA, butcontinuously extend from the first area 1A to the second area 2A, and ifthe first conductive layer 215 c is on such an inorganic insulatinglayer, large tensile stress is applied to the first conductive layer 215c during bending of the substrate 100. In particular, since theinorganic insulating layer has a greater hardness than that of theorganic material layer, cracks are likely to form in the inorganicinsulating layer in the bending area BA, and when a crack occurs in theinorganic insulating layer, a crack may also occur in the firstconductive layer 215 c on the inorganic insulating layer and thus theprobability of generating defects such as disconnections in the firstconductive layer 215 c increases greatly.

However, according to the display apparatus of the embodiment, theinorganic insulating layer includes the first opening corresponding tothe bending area BA, and the part of the first conductive layer 215 cwhich corresponds to the bending area BA is on the organic materiallayer 160 that at least partially fills the first opening. Since theinorganic insulating layer includes the first opening corresponding tothe bending area BA, the possibility of cracks occurring in theinorganic insulating layer is greatly decreased, and the organicmaterial layer 160 is less likely to have cracks due to characteristicsof the organic material. Therefore, the occurrence of cracks in theportion of the first conductive layer 215 c on the organic materiallayer 160 may be prevented or reduced, wherein the portion of the firstconductive layer 215 c corresponds to the bending area BA. Since theorganic material layer 160 has a lower hardness than that of aninorganic material layer, the organic material layer 160 may absorb thetensile stress generated due to the bending of the substrate 100 so asto reduce concentration of the tensile stress in the first conductivelayer 215 c.

In FIG. 2, the inorganic insulating layer has the first opening, but isnot limited thereto. For example, the inorganic insulating layer mayhave a first feature that is a first groove, rather than the firstopening. For example, the buffer layer 110 may not include the opening110 a unlike the example shown in FIG. 2, but may extend in continuousmanner from the first area 1A to the second area 2A across the bendingarea BA. Then, the gate insulating layer 120 and the interlayerinsulating layer 130 may only include the openings 120 a and 130 a. Inthis case, the buffer layer 110, the gate insulating layer 120, and theinterlayer insulating layer 130, which include the inorganic material,may be collectively referred to as an inorganic insulating layer, and inthis case, the inorganic insulating layer may be understood to have thefirst groove corresponding to the bending area BA. In addition, theorganic material layer 160 may at least partially fill the first groove.

In the above case, since the inorganic insulating layer has the firstgroove corresponding to the bending area BA, a thickness of theinorganic insulating layer is reduced in the bending area BA, andaccordingly, the substrate 100 may be more easily bent. In addition,since the organic material layer 160 is in the bending area BA and thefirst conductive layer 215 c is above the organic material layer 160,damage to the first conductive layer 215 c during the bending operationmay be effectively prevented. An example in which the inorganicinsulating layer includes the first opening is described in the aboveembodiments and other embodiments that will be described later, ormodified examples thereof for convenience of description, but theinorganic insulating layer may instead include the first groove asdescribed above.

The display apparatus according to the embodiment may include secondconductive layers 213 a and 213 b, in addition to the first conductivelayer 215 c. The second conductive layers 213 a and 213 b are locatedabove the first area 1A or the second area 2A to be located at adifferent layer from that of the first conductive layer 215 c, and maybe electrically connected to the first conductive layer 215 c. In FIG.2, the second conductive layers 213 a and 213 b are at the same layer,that is, on the gate insulating layer 120, and use the same material asthat of the gate electrode 213. In addition, the first conductive layer215 c contacts the second conductive layers 213 a and 213 b via contactholes in the interlayer insulating layer 130. In addition, the secondconductive layer 213 a is in the first area 1A, and the secondconductive layer 213 b is in the second area 2A.

The second conductive layer 213 a in the first area 1A may beelectrically connected to the TFT 210 in the display area DA, andaccordingly, the first conductive layer 215 c may be electricallyconnected to the TFT 210 in the display area DA via the secondconductive layer 213 a. The second conductive layer 213 b in the secondarea 2A may also be electrically connected to the TFT 210 of the displayarea DA, via the first conductive layer 215 c. As such, the secondconductive layers 213 a and 213 b that are outside the display area DAmay be electrically connected to the elements in the display area DA, ormay extend toward the display area DA so that at least some parts of thesecond conductive layers 213 a and 213 b may be located in the displayarea DA.

As described above, although FIG. 2 shows a state in which the displayapparatus is not bent for convenience of description, the displayapparatus according to the embodiment is actually in a state in whichthe substrate 100 is bent at the bending area BA, as shown in FIG. 1. Todo this, the display apparatus is manufactured so that the substrate 100is flat, as shown in FIG. 2, and after that, the substrate 100 is bentat the bending area BA so that the display apparatus may have the shapeas shown in FIG. 1. Here, while the substrate 100 is bent at the bendingarea BA, tensile stress may be applied to the elements in the bendingarea BA.

Therefore, the first conductive layer 215 c crossing over the bendingarea BA includes a material having high elongation rate, so that defectssuch as cracks in the first conductive layer 215 c or disconnection ofthe first conductive layer 215 c may be prevented. In addition, thesecond conductive layers 213 a and 213 b, including a material having anelongation rate lower than that of the first conductive layer 215 c andelectrical/physical characteristics different from those of the firstconductive layer 215 c, are formed in the first area 1A or the secondarea 2A, and thus, an efficiency of transferring electric signals in thedisplay apparatus may be improved or a defect rate during themanufacturing processes of the display apparatus may be reduced.

For example, the second conductive layers 213 a and 213 b may includemolybdenum, and the first conductive layer 215 c may include aluminum.The first conductive layer 215 c and the second conductive layers 213 aand 213 b may have multi-layered structures, if desired. For example,the first conductive layer 215 c may have a multi-layered structure suchas a titanium layer/aluminum layer/titanium layer structure, and thesecond conductive layers 213 a and 213 b may each have a multi-layeredstructure such as a molybdenum layer/titanium layer structure. However,one or more embodiments are not limited thereto, that is, the firstconductive layer 215 c may extend to the display area to be electricallyconnected directly to the source electrode 215 a, the drain electrode215 b, or the gate electrode 213 of the TFT 210.

In addition, as shown in FIG. 2, the organic material layer 160 maycover an internal surface of the first opening of the inorganicinsulating layer. As described above, since the first conductive layer215 c may include the same material as, and may be formed simultaneouslywith, the source electrode 215 a and the drain electrode 215 b, aconductive layer may be formed on the interlayer insulating layer 130over an entire surface of the substrate 100 and may be patterned to formthe source electrode 215 a, the drain electrode 215 b, and the firstconductive layer 215 c. If the organic material layer 160 does not coverthe inner side surfaces of the opening 110 a in the buffer layer 110,the opening 120 a in the gate insulating layer 120, or the opening 130 ain the interlayer insulating layer 130, the conductive material of theconductive layer may not be removed from, but may remain on, these innerside surfaces. In this case, the remaining conductive material may causeshorts between different conductive layers.

Therefore, when the organic material layer 160 is formed, the organicmaterial layer 160 may cover the inner side surface of the first openingin the inorganic insulating layer. If the organic material layer 160includes a second feature that is a second opening 160 a that will bedescribed later, in order to make the organic material layer 160 coverthe internal surface of the first opening in the inorganic insulatinglayer, a width OW of the inorganic insulating layer in a direction fromthe first area 1A towards the second area 2A may be greater than alength d of the second opening 160 a of the organic material layer 160in a direction in which the second opening 160 a extends.

In FIG. 2, the organic material layer 160 is shown to have a largelyconstant thickness, but the organic material layer 160 may have athickness that varies depending on locations therein, so that an uppersurface of the organic material layer 160 may have a gradual curve nearedges of the opening 110 a in the buffer layer 110, the opening 120 a inthe gate insulating layer 120, and the opening 130 a in the interlayerinsulating layer 130. Accordingly, remaining conductive material thatshould have been removed may be prevented during patterning theconductive layer in order to form the source electrode 215 a, the drainelectrode 215 b, and the first conductive layer 215 c.

In addition, a bending protection layer (BPL) 600 may be located outsidethe display area DA. That is, the BPL 600 may be located above the firstconductive layer 215 c, corresponding at least to the bending area BA.

When a stack structure is bent, there is a stress neutral plane in thestack structure. If there is no BPL 600, when the substrate 100 is bent,excessive tensile stress may be applied to the first conductive layer215 c in the bending area BA, because the location of the firstconductive layer 215 c may not correspond to a stress neutral plane.However, by forming the BPL 600 and adjusting a thickness and a modulusof the BPL 600, a location of the stress neutral plane in the structureincluding the substrate 100, the first conductive layer 215 c, and theBPL 600 may be adjusted. Therefore, the stress neutral plane may beadjusted to be around the first conductive layer 215 c via the BPL 600,and thus, the tensile stress applied to the first conductive layer 215 cmay be reduced or a compressive stress may be applied to the firstconductive layer 215 c. The BPL 600 may include acryl. When compressivestress is applied to the first conductive layer 215 c, the possibilityof damaging the first conductive layer 215 c is much less than whentensile stress is applied to the first conductive layer 215 c.

In FIG. 4, an end surface of the BPL 600 facing an edge of the substrate100 (+y direction) does not coincide with an end surface of thesubstrate 100, but is located on a top surface of the substrate 100.However, one or more embodiments are not limited thereto, that is, theend surface of the BPL 600 may correspond to the end surface of thesubstrate 100 (see FIG. 15). Otherwise, unlike the example shown in FIG.4, an additional BPL that is spaced apart from the BPL 600 to be locatedcloser to the edge of the substrate 100 (+y direction) may be provided.This may be understood that the BPL 600 has an opening that penetratesthrough the BPL in an up-and-down direction, similarly to the secondopening 160 a of the organic material layer 160 which will be describedlater.

In particular, when a plurality of display units are formed on a mothersubstrate and then the mother substrate is cut to simultaneouslymanufacture a plurality of display apparatuses, the BPL 600 may beformed before the cutting process. In this case, the BPL is also cutwhen the mother substrate is cut, and accordingly, the end surface ofthe BPL 600 may correspond to the end surface of the substrate 100. Thecutting may be performed by irradiating a laser beam to the mothersubstrate.

In addition, in FIG. 2, an upper surface of the BPL 600 in a directiontowards the display area DA (−x direction) corresponds to an uppersurface of the polarization plate 520 (in the +z direction), but is notlimited thereto. For example, an end of the BPL 600 in the directiontowards the display area DA (−x direction) may partially cover an uppersurface at the edge of the polarization plate 520. Otherwise, the end ofthe BPL 600 in the direction towards the display area DA (−x direction)may not contact the polarization plate 520 and/or the OCA 510. In thelatter case, during or after forming the BPL 600, movement of gasgenerated from the BPL 600 in a direction toward the display area DA (−xdirection), which risks degrading the display device 300, may beprevented.

As shown in FIG. 2, if the upper surface of the BPL 600 in a directiontowards the display area DA (−x direction) coincides with the uppersurface of the polarization plate 520 in the +z direction, if the end ofthe BPL 600 in the display area DA direction (−x direction) partiallycovers the upper surface at the end of the polarization plate 520, or ifthe end of the BPL 600 in the display area DA direction (−x direction)contacts the OCA 510, a thickness of the BPL 600 corresponding to thedisplay area DA (−x direction) may be greater than that of the otherportions in the BPL 600. Since a liquid phase material or a paste-typematerial may be applied and hardened to form the BPL 600, a volume ofthe BPL 600 may be reduced through the hardening process. Here, if theportion of the BPL 600 corresponding to the display area DA (−xdirection) is in contact with the polarization plate 520 and/or the OCA510, the portion of the BPL 600 is fixed at the location, and thus, avolume reduction occurs in the remaining portion of the BPL 600.Therefore, the thickness of the BPL 600 corresponding or proximate tothe display area DA (−x direction) may be greater than that of the restof the BPL 600.

In addition, the organic material layer 160 in the display apparatusaccording to the embodiment includes the second opening 160 a extendingalong an edge of the substrate 100 as shown in FIG. 3. In FIG. 3, theorganic material layer 160 includes second openings 160 a that extendproximate to the edges of the substrate 100. Since the organic materiallayer 160 has the second openings 160 a, occurrence of defects duringmanufacturing the display apparatus or using the display apparatus thatis manufactured may be reduced.

Although FIG. 3 shows a state in which the substrate 100 is not bent forconvenience of description, the display apparatus according to theembodiment is actually bent at the bending area BA, as shown in FIG. 1.Therefore, the bending area BA is located at an edge of the displayapparatus. During the manufacturing processes or afterward, shock may beapplied to the bending area BA. In particular, shock is more likely tobe applied to an edge of the bending area BA in the +y direction or −ydirection, and in this case, as shown in FIG. 4 that is a schematiccross-sectional view taken along a line IV-IV of FIG. 3, crack CR mayoccur in the organic material layer 160 due to external shock. If such acrack CR reaches a center portion of the bending area BA, cracks mayalso occur in wires such as the first conductive layer 215 c, generatingdefects in the display apparatus.

However, according to the display apparatus of the embodiment, theorganic material layer 160 includes the second openings 160 a asdescribed above. The second openings 160 a extend along the edges of thesubstrate 100 (in the +x direction when viewed as if the substrate 100is not bent). Therefore, even if the crack CR occurs at the edge of theorganic material layer 160 as shown in FIG. 4, the crack CR may notreach the center portion of the bending area BA, but may be stopped bythe second openings 160 a. As such, even if shock is applied to an outerportion of the bending area BA during manufacturing processes orafterward, generation of defects due to cracks in the display apparatusmay be prevented or reduced.

In order to promote defect prevention or reduction effects throughoutthe entire bending area BA, a length d of the second opening 160 a inits lengthwise direction (see FIG. 3) may be greater than the width BAwof the bending area BA from the first area 1A to the second area 2A. Assuch, occurrence of cracks in the entire bending area BA due to shockapplied to the edge of the substrate 100 may be prevented or reduced.

In addition, the second openings 160 a of the organic material layer 160may not necessarily penetrate through the organic material layer 160 asabove. For example, as shown in FIG. 5 that is a schematiccross-sectional view of a part of a display apparatus according to anembodiment, the organic material layer 160 may include a second featurethat is a second groove 160 a, rather than the second opening 160 a. Inthis case, propagation of cracks CR generated in the organic materiallayer 160 towards the center portion of the bending area BA may beeffectively prevented by the second groove 160 a. The above and otherdescriptions of the second opening 160 a may be applied to the secondgroove 160 a.

Moreover, as shown in FIG. 6 that is a schematic cross-sectional view ofa part of a display apparatus according to an embodiment, in addition tothe organic material layer 160 including the second opening 160 a, theplanarization layer 140 above the organic material layer 160 may alsoinclude a third feature that is a third opening 140 a corresponding tothe second opening 160 a. The third opening 140 a of the planarizationlayer 140 may extend an edge of the substrate 100 like the secondopening 160 a of the organic material layer 160. That is, similar to thesecond opening 160 a shown in FIG. 3, the planarization layer 140 mayhave third openings 140 a extending along the edges of the substrate100.

The third openings 140 a extend along the edge of the substrate 100 (inthe +x direction when viewed as if the substrate 100 is not bent).Therefore, as shown in FIG. 6, even if crack CR occurs at the edge ofthe organic material layer 160 and/or the planarization layer 140, thecrack CR may not reach the center portion of the bending area BA, butmay be stopped around the second opening 160 a and the third opening 140a. As such, even if shock is applied to the outer portion of the bendingarea BA during manufacturing processes or utilizing processes aftermanufacturing, defects caused by cracks in the display apparatus may beprevented or reduced.

In order to promote defect prevention or reduction effects throughoutthe entire bending area BA, a length of the third opening 140 a of theplanarization layer 140 may be greater than the width BAw of the bendingarea BA from the first area 1A to the second area 2A. As such,occurrence of cracks in the entire bending area BA due to shock appliedto the edge of the substrate 100 may be prevented or reduced.

The planarization layer 140 may not necessarily have the third opening140 a penetrating through the planarization layer 140 as above. That is,the planarization layer 140 may include a third feature that is a thirdgroove, not the third opening 140 a. This is also applied to theabove-described embodiments, embodiments that will be described later,or modified examples thereof. In addition, the embodiment may bevariously modified, for example, the organic material layer 160 may notinclude the second opening 160 a or the second groove 160 a and theplanarization layer 14 may only include the third opening 140 a or thethird groove 140 a. This is also applied to the above-describedembodiments, embodiments that will be described later, or modifiedexamples thereof.

As described above, when the organic material layer 160 has the secondopening 160 a and the planarization layer 140 has the third opening 140a, the BPL 600 may at least partially fill the second opening 160 a orat least partially fill the third opening 140 a. The BPL 600 may notonly fill the second opening 160 a or the third opening 140 a at leastpartially, but may also cover the bending area BA.

As described above, the BPL 600 adjusts the location of a stress neutralplane. If the BPL 600 does not fill the second opening 160 a or thethird opening 140 a, the stress neutral plane is located at anintermediate portion between the upper and lower surfaces of thesubstrate 100 under the second opening 160 a or the third opening 140 a,and peripheral portions thereof. Accordingly, when the substrate 100 isbent, compressive stress is applied to a part, e.g., from a centerportion toward the lower surface, of the substrate 100, but tensilestress is applied to a part, e.g., from the center portion toward theupper surface, of the substrate 100. Accordingly, cracks or tears mayoccur between the center portion and the upper surface of the substrate100. However, the BPL 600 fills at least partially the second opening160 a or the third opening 140 a so as to adjust the location of thestress neutral plane, and thus, occurrence of defects in the substrate100 may be prevented or reduced. Even if a crack CR occurs in theorganic material layer 160 and/or the planarization layer 140, thesecond opening 160 a or the third opening 140 a may prevent or reducepropagation of the crack CR toward the center portion of the bendingarea BA.

In addition, as shown in FIG. 6, the planarization layer 140 may coveran internal side surface of the second opening 160 a in the organicmaterial layer 160. As described above, the first conductive layer 215 cmay be simultaneously formed with the source electrode 215 a and thedrain electrode 215 b by using the same material as that of the sourceand drain electrodes 215 a and 215 b. To accomplish this, a conductivelayer is formed above the organic material layer 160 and/or theinterlayer insulating layer 130 throughout almost the entire surface ofthe substrate 100, and is then patterned to form the source electrode215 a, the drain electrode 215 b, and the first conductive layer 215 c.Therefore, as shown in FIG. 7 that is an enlarged cross-sectional viewof a part A of FIG. 6, a conductive material may remain on the internalside surface of the second opening 160 a in the organic material layer160, and thus, a conductive remaining layer 215 c′ may remain at leastpartially along the internal side surface of the second opening 160 a.

The conductive remaining layer 215 c′ may cause shorts between twodifferent conductive layers, or cause defects. For example, when thepixel electrode 310 (see FIG. 2) is formed, a material for forming thepixel electrode 310 may agglomerate around the conductive remaininglayer 215 c′. This is because, if the conductive remaining layer 215 c′includes aluminum and the pixel electrode 310 includes silver (Ag), thissilver may react with aluminum to form a lump around the conductiveremaining layer 215 c′.

Therefore, as shown in FIG. 7, since the planarization layer 140 coversthe internal side surface of the second opening 160 a in the organicmaterial layer 160 so as to cover the conductive remaining layer 215 c′,the conductive remaining layer 215 c′ may not be exposed. As such,occurrence of defects during manufacturing processes may be prevented orreduced. Since the conductive remaining layer 215 c′ may be generatedwhen the first conductive layer 215 c is formed as described above, theconductive remaining layer 215 c′ may include at least some of thematerials included in the first conductive layer 215 c. As describedabove, the first conductive layer 215 c may include titanium oraluminum, and if desired, may have a multi-layered structure includingtitanium layer/aluminum layer/titanium layer. Therefore, the conductiveremaining layer 215 c′ may also include titanium, aluminum, or a mixtureor a compound thereof.

FIG. 8 is a schematic cross-sectional view taken along a line VIII-VIIIof FIG. 3. As shown in FIG. 8, the length d (see FIG. 3) of the secondopening 160 a in the organic material layer 160 may be greater than thelength of the third opening 140 a in the planarization layer 140. Thus,as described above with reference to FIG. 7, the planarization layer 140may cover the conductive material that may remain on the internal sidesurface of the second opening 160 a.

In the above description, a case where the organic material layer 160includes the second opening 160 a is described, but one or moreembodiments are not limited thereto. As shown in FIG. 9 that is aschematic plan view of a part of a display apparatus according to anembodiment, the organic material layer 160 may include an additionalopening 160 b or an additional groove. The additional opening 160 b orthe additional groove may extend along the edge of the substrate 100adjacent to the second opening 160 a. As described above, since theorganic material layer 160 includes the additional opening 160 b or theadditional groove in addition to the second opening 160 a, propagationof the crack CR (see FIGS. 4 to 6) towards the center portion of thebending area BA may be blocked twice.

In addition, although FIG. 9 shows a state in which the substrate 100 isnot bent for convenience of description, the display apparatus accordingto the embodiment is actually bent at the bending area BA, as shown inFIG. 1. Therefore, unlike that shown in FIG. 9, the bending area BA islocated at the edge of the display apparatus, and in particular, avirtual line IL that is in parallel with the bending axis BAX (seeFIG. 1) and crosses a center of the bending area BA, is located at theedge of the display apparatus. Therefore, external shock may be appliedto the portion of the bending area BA on which the virtual line IL islocated. Accordingly, the additional opening 160 b or the additionalgroove of the organic material layer 160 is located to cross the virtualline IL, so as to doubly prevent crack CR from proceeding towards thecenter portion of the bending area BA. That is, although a length of theadditional opening 160 b or the additional groove may be less than thatof the second opening 160 a, the additional opening 160 b or theadditional groove may still cross the virtual line IL.

Otherwise, in order to achieve similar effects to the above, as shown inFIG. 10 that is a schematic plan view of a part of a display apparatusaccording to an embodiment, the second opening 160 a in the organicmaterial layer 160 may have a variable width. That is, the secondopening 160 a may have a greater width at a portion crossing the virtualline IL that is parallel with the bending axis BAX (see FIG. 1) andcrossing the center of the bending area BA, than that of at least oneother portion. The greater the width of the second opening 160 a is, theless the possibility of propagating the crack CR at that location. Also,as shown in FIG. 11 that is a schematic plan view of a part of a displayapparatus according to an embodiment, the second opening 160 a extendsalong the edge of the substrate 100, but an intermediate portion of thesecond opening 160 a in a length direction thereof is curved towards thecenter of the bending area BA so that the second opening 160 a may havea meniscus shape.

As shown in FIG. 12 that is a schematic plan view of a part of a displayapparatus according to an embodiment, the organic material layer 160 mayfurther include an auxiliary opening 160 c or an auxiliary groove. Theauxiliary opening 160 c or the auxiliary groove may be connected to thesecond opening 160 a and may extend in a direction crossing thelengthwise direction of the second opening 160 a. The organic materiallayer 160 may have a plurality of auxiliary openings 160 c or aplurality of auxiliary grooves, and in this case, the auxiliary openings160 c or the auxiliary grooves may be located alternately at oppositesides of the second opening 160 a in the direction in which the secondopening 160 a extends.

Also, as shown in FIG. 13 that is a schematic plan view of a part of adisplay apparatus according to an embodiment, the second opening 160 aof the organic material layer 160 extends along the edge of thesubstrate 100, and a plurality of islands of the organic material layer160 may be located therein.

In addition, it is described above that the second opening or the secondgroove extends along the edge of the substrate 100, but one or moreembodiments are not limited thereto. In addition, the second opening orthe second groove may not be formed in the organic material layer 160,but may be formed in another portion. That is, when the substrate 100including the bending area BA between the first area 1A and the secondarea 2A is bent about the bending axis BAX and the first conductivelayer 215 c extends from the first area 1A to the second area 2A throughthe bending area BA, the insulating layer disposed between the substrate100 and the first conductive layer 215 c may have a first opening or afirst groove that extends in a direction crossing the bending axis BAXto correspond to a portion between the edge of the substrate 100 and thefirst conductive layer 215 c at the bending area BA. Here, if thedisplay apparatus includes a plurality of first conductive layers 215 c,the portion between the edge of the substrate 100 and the firstconductive layer 215 c may be understood as a portion between the edgeof the substrate 100 and a first conductive layer among the plurality offirst conductive layers 215 c which is closest to the edge of thesubstrate 100.

FIG. 14 is a schematic plan view of a part of a display apparatusaccording to an embodiment, and FIG. 15 is a schematic cross-sectionalview taken along a line XV-XV of FIG. 14. The display apparatusaccording to the embodiment is different from the display apparatusaccording to the previous embodiment illustrated with reference to FIG.3 in view of a shape of a second opening 160 a′ in the organic materiallayer 160. As shown in FIGS. 14 and 15, the second opening 160 a′ of theorganic material layer 160 may extend to the end of the substrate 100(in the +y direction or −y direction).

In this case, the planarization layer 140, that is, an additionalorganic material layer, may extend to the edge of the substrate 100 soas to fill the extended second opening 160 a′ of the organic materiallayer 160. In particular, as shown in FIG. 15, a side end surface of theplanarization layer 140 and a side end surface of the BPL 600 roughlycorrespond to a side end surface of the substrate 100, and thus, theedge of the substrate 100 may be sufficiently supported by theplanarization layer 140 and/or the BPL 600 even when the organicmaterial layer 160 includes the second opening 160 a′. As such, even ifthe substrate 100 that is flexible or bendable is very small inthickness, unintentional deformation of the substrate 100 may beeffectively prevented.

In addition, as shown in FIG. 16 that is a schematic cross-sectionalview of a part of a display apparatus according to an embodiment,similar to the organic material layer 160, a third opening 140 a′ of theplanarization layer 140 may extend to the end of the substrate 100 (inthe +y direction or −y direction). In this case, the side end surface ofthe BPL 600 roughly corresponds to the side end surface of the substrate100, and thus, the BPL 600 may sufficiently support the edge of thesubstrate 100 even when the organic material layer 160 includes theextended second opening 160 a′ and the planarization layer 140 includesthe extended third opening 140 a′. As such, even if the substrate 100that is flexible or bendable is very small in thickness, unintentionaldeformation of the substrate 100 may be effectively prevented.

As shown in FIG. 17 that is a schematic cross-sectional view of a partof a display apparatus according to an embodiment, the organic materiallayer 160 may extend to the edge of the substrate 100 and theplanarization layer 140 has a third opening 140 a′ that may extend tothe end of the substrate 100 (in the +y direction or −y direction). Inthis case, the side end surface of the BPL 600 may roughly correspond tothe side end surface of the substrate 100.

In FIGS. 15 to 17, the organic material layer 160 includes the secondopening 160 a′ extending to the edge of the substrate 100 or theplanarization layer 140 includes the third opening 140 a′ extending tothe edge of the substrate 100, but one or more embodiments are notlimited thereto. For example, the organic material layer 160 may includea second groove extending to the edge of the substrate 100, and theplanarization layer 140 may include a third groove extending to the edgeof the substrate 100.

According to one or more embodiments, the display apparatus capable ofreducing generation of defects during or after manufacturing may beimplemented. However, the scope of the inventive concept is not limitedto the above effects.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims.Various features of the above described and other embodiments can bemixed and matched in any manner, to produce further embodimentsconsistent with the invention.

What is claimed is:
 1. A display apparatus comprising: a substratecomprising a first area, a second area, and a bending area, wherein thebending area is connected between the first area and the second area andis bent about a bending axis; a first conductive layer overlapping eachof the first area, the second area, and the bending area; and a firstorganic material layer covering the first conductive layer, directlycontacting the first conductive layer, and directly contacting a portionof the bending area.
 2. The display apparatus of claim 1, furthercomprising: a thin film transistor overlapping the first area; and apixel electrode electrically connected to the thin film transistor,wherein a portion of the first organic material layer is disposedbetween the thin film transistor and the pixel electrode and overlapsthe first area.
 3. The display apparatus of claim 1, further comprisinga bending protection layer directly contacting the first organicmaterial layer and overlapping the bending area.
 4. The displayapparatus of claim 1, wherein the first conductive layer is disposedbetween the substrate and the first organic material layer.
 5. Thedisplay apparatus of claim 1, further comprising a thin film transistoroverlapping the first area, wherein a material of the first conductivelayer is identical to a material of a source electrode or a drainelectrode of the thin film transistor.
 6. The display apparatus of claim1, further comprising a second organic material layer overlapping thebending area, comprising an opening, and disposed between the substrateand the first organic material layer.
 7. The display apparatus of claim6, wherein a length of the opening is greater than a width of thebending area in a lengthwise direction of the opening.